This server contains information about the objectives of the
ARPA/ESTO MEMS program, the ARPA's vision statement for MEMS, details
of the MEMS BAA and will soon contain summaries of ARPA funded MEMS
research in various organizations.
The MEMS Interchange on the Semiconductor Subway
is a page collecting sources of MEMS fabrication and modelling
information and other WWW pages of interest to the MEMS community.
Information on research conducted at The University of Texas at Austin by
Dr. Dean P. Neikirk into optical pressure sensors, magnetic proximity
sensors, and the use of MEMS technology for "smart" mechanical bearings can
be found here.
The Japanese Technology Evaluation Center (JTEC) and its
companion World Technology Evaluation Center (WTEC) at Loyola College
provide assessments of foreign research and development in selected
technologies under a cooperative agreement with the National Science
Foundation (NSF). A study of MEMS in Japan is available.
Microelectromechanical Systems (MEMS) research at Case Western
Reserve University is an interdisciplinary effort comprising faculty,
staff, visiting scholars, and students from four academic
departments. Our group brings together experts in all facets of MEMS
-- design, modeling, fabrication, materials, devices (sensors,
actuators, and electronics), and applications -- to address the
critical scientific and technological issues for advancing MEMS.
The Stanford CDR maintains information on a wide
variety of research projects that include collaborative
design, national studies on engineering education, and
computational agent infrastructures for distributed
collaborative engineering. There is also a DesignNet
directory of design research services.
The Berkeley Sensor and Actuator Center (BSAC) is a
NSF/Industry/University cooperative research center funded by the
National Science Foundation and a consortium of corporations and
government agencies. Since its foundation in 1986, BSAC has been
devoted to research on sensors and miniature moving mechanical
elements that take advantage of the remarkable progress made in IC
technology.
It is a prototyping service for standard cell and
full-custom VLSI circuit development. MOSIS is in the
process of expanding their service to include MEMS devices.
The MCNC MEMS Technology Applications Center serves as a focal
point in the transistion of MEMS technology from research to
commercial products. It is accessible to small and large companies
for feasibility studies, engineering development, prototyping, and
manufacturing studies while protecting proprietary ideas through
nondisclosure and intellectual property agreements. MCNC also
provides inexpensive MEMS prototyping for the R&D community through an
ARPA sponsored multiproject, multi-user, MEMS process (MUMPS) runs.
Synergy at UCLA contains Micro Electro Mechanical Systems related
information. These include UCLA MEMS major field announcements, some
electron microscope pictures of the work done by Prof. Pister and his
students as well as a description the the UCLA Nanofabrication
Research Facility.
Information about integrated microoptical devices (integrated
silicon adaptive mirror and deformable mirror display), developed in
the Electronic Instrumentation Laboratory of the Dept. of EE, Delft
University.
Information about the Analog Devices Inc and UC Berkeley
investigation on the Integrated Micro Electro Mechanical Systems
(iMEMS) project. Also presented is information about the surface
micromachining capabilities at ADI.
A mirror site for MEMS users on the East Coast of the United
States is provided for faster responses. Information contained here
is about the i MEMS project as above.
Research into Artifacts, Center for Engineering (RACE) at the
University of Tokyo studies design of artifacts for their higher
alliance with the human society and environment. The page Hyper
Process Knowledge Base describes one of their projects on
manufacturing knowledge sharing, with visual demonstrations of MEMS
fabrication processes (quicktime movies included).
Recent experimental and analytical evidence indicates that direct
drive robots become very practical and economical at miniature and
microscopic scales, so it is interesting to understand quantitatively
the properties of direct drive robots under scaling
transformations.
CAEMEMS is a software framework for the design of sensor and actuator
CAE systems. In its present form, CAEMEMS consists of the CAEMEMS
D-Module and an array of supporting software for the generation,
execution, and plotting of finite-element analyses (FEA) of diaphragm
pressure sensors. Use is made of the ANSYS commercial FEA system.
This link contains extensive information on current MEMS research
at the University of Sheffield, UK. Example projects are a novel
ROTATING microgyroscope under patent application, micro-speaker for
hearing aids, and micro-electric generator for implanted microsystems.
The IfM is an interdisciplinary organization that is committed to
partnerships and can provide diversity in process research and
development activities yielding the best miniaturization technologies
for the economic manufacture of small products.
Here is the link to the IEEE Organization's MEMS Page. The
Journal of Microelectromechanical Systems (JMEMS) publishes
information on MEMS including fabrication techniques, microphenomena,
materials, microsystems, and applications of devices ranging from
microns to millimeters. Please click on JMEMS for information
on published articles, abstracts, paper submissions, subscriptions,
and topics of interest. The Journal is sponsored by the IEEE and the
ASME.
The Electronics Subcommittee, established by the Civilian Industrial
Technology Committee under the President's National Science and Technology
Council, has developed the ESC NAVIGATOR, a tool to inventory and search
federally-funded research and development programs in electronics.
If you are currently working on an electronics research and development
project that is funded by the United States Government, the Electronics
Subcommittee requests that you submit to the NAVIGATOR the following
minimal information:
1. Program Name
2. Sponsoring Agency
3. URL Address/Point of Contact
4. Brief description of program using predefined criteria
It takes about 5 minutes to add the requested information.